Protect your floors with the Kilsaran LevelEase Floor DPM, a cutting-edge damp proof membrane designed to suppress residual moisture in cementitious substrates up to 95% relative humidity. Ideal for internal applications where structural damp proofing is damaged or absent, this one-component, water-based damp proof membrane creates a continuous, pinhole-free barrier, ensuring compatibility with leveling compounds, adhesives, and underfloor heating systems without requiring additional primers.

Part of the LevelEase Floor Range, this damp proof membrane’s fast-drying properties and low-VOC formulation make it a reliable choice for preventing moisture damage in renovations, new builds, and commercial projects, offering durability and compliance with modern construction standards KPRO Floor LevelEase DPM is a one-component, water-based residual moisture vapor suppressant, designed to suppress residual construction moisture in cementitious substrates. It is ready-to-use, with fast drying properties and a durable, protective coating suitable for internal floor applications where moisture content is up to 95%.

Applications

KPRO Floor LevelEase DPM (Damp Proof Membrane) is ideal for places where structural damp proof membrane is damage or no existent:

• Damp proofing cementitious subfloors prior to applying leveling compounds or adhesives.
• Suitable for use on heated screeds, provided they are installed per industry standards.
• Can be applied over power-floated

Product Use

Ensure the substrate is clean, sound, and free of dust, laitance, or contamination that may
impair adhesion.Remove any loose materials and ensure the surface is structurally stable
before application.

• Suitable for use on substrates up to 95% RH.
• Ready-to-use, no mixing required.
• Provides a continuous, pinhole-free moisture barrier.
• Compatible with leveling and smoothing compounds without the need for priming.
• Low VOC, water-based formulation.

Benefits

• Suitable for use on substrates up to 95% RH.
• Ready-to-use, no mixing required.
• Provides a continuous, pinhole-free moisture barrier.
• Compatible with leveling and smoothing compounds without the need for priming.
• Low VOC, water-based formulation.